Saesol Diamond produces CMP Pad Conditioners used in the cutting-edge semiconductor industry. Winning the trust of semiconductor manufacturers globally with our technical prowess through constant technology development and quality innovation.
Standard
Utilizing one diamond size across the conditioner.
HIVE
Honeycomb structure offer high diamond density products.
Dual Size
Design utilizes two types of diamonds to enhance disk lifetime.
Hybrid Brazed
Designed to offer enhanced durability in highly erosive environments.
CLC
Designed to have the same height of diamonds and offer mild conditioning.
CVD
Products designed with control of tip indentation based on customer needs.
Ring / Plate / Bar
Different styles of conditioners based on equipment and customer needs.
Pad Dresser
Gear & Segment combination products used in wafer polishing process.