
Saesol Diamond produces CMP Pad Conditioners used in the cutting-edge semiconductor industry. Winning the trust of semiconductor manufacturers globally with our technical prowess through constant technology development and quality innovation.
Standard

Utilizing one diamond size across the conditioner.
HIVE

Honeycomb structure offer high diamond density products.
Dual Size

Design utilizes two types of diamonds to enhance disk lifetime.
Hybrid Brazed

Designed to offer enhanced durability in highly erosive environments.
CLC

Designed to have the same height of diamonds and offer mild conditioning.
CVD

Products designed with control of tip indentation based on customer needs.
Ring / Plate / Bar

Different styles of conditioners based on equipment and customer needs.
Pad Dresser

Gear & Segment combination products used in wafer polishing process.